High-Conductivity Thermal Pads for Electronics Cooling

HRTP-M16-T05060NH Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

HRTP-M16 -N01560NN Series is an acrylic thermal conductive interface filling gasket. Due to its soft texture and inherent adhesion on the surface, it is suitable for use in the compression process of integrated circuit chips It can reduce load and is a high-performance silicon-free thermal conductive gasket with high thermal conductivity and a soft interface.

HRTP-M16-T10065NV Series is an ultra-low volatility thermal conductive silicone pad, which is made of silicone as the matrix and filled with various high-performance ceramic powders. It has low thermal resistance, good electrical insulation, good heat dissipation performance, and ultra-low volatility.

HRTP-M16-T08060NV Series is an ultra-low volatility thermal conductive silicone pad, which is made of silicone as the matrix and filled with various high-performance ceramic powders. It has low thermal resistance, good electrical insulation, good heat dissipation performance, and ultra-low volatility.

HRTP-M16-T06060NV Series is an ultra-low volatility thermal conductive silicone pad, which is made of silicone as the matrix and filled with various high-performance ceramic powders. It has low thermal resistance, good electrical insulation, good heat dissipation performance, and ultra-low volatility.

HRTP-M16-T03060FN Series thermal conductivity interface material is used to fill the air gap between the heating device and the heat sink or metal base. Its flexible and elastic characteristics enable it to cover very uneven surfaces. Heat is transferred from the separating device or the entire PCB to the metal shell or diffusion plate, thereby improving the efficiency and service life of the heating electronic components. The addition of fiberglass is to increase product strength.

HRTP-M16-T120xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

HRTP-M16-T100xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

HRTP-M16-T080xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

HRTP-M16-T060xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

HRTP-M16-T050xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.