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High-Conductivity Thermal Pads for Electronics Cooling
Suzhou Springgrass is a premier manufacturer of high-performance thermal pads, designed to bridge heat sources and sinks for optimal electronic thermal management.
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Versatile Solutions: Offering ultra-thin pads for compact designs and soft silicone sheets for uneven surfaces.
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Reliable Heat Dissipation: Engineered to ensure the longevity and peak performance of CPUs and power components.
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Custom Die-Cut & OEM (MOQ: 10K pcs): Choose from our standard thermal gap pad sheets or request precision custom die-cut services tailored to your mass production needs.
3W/mk Silicon-Free Thermal Pad HRTP-M16-N03050NN Series
HRTP-M16-N03050NN Series is an acrylic thermal conductive interface filling gasket. Due to its soft texture and inherent adhesion on the surface, it is suitable for use in the compression process of integrated circuit chips It can reduce load and is a high-performance silicon-free thermal conductive gasket with high thermal conductivity and a soft interface.
2W/mk Silicon-Free Thermal Pad HRT P-M16 -N02060NN Series
HRT P-M16 -N02060NN Series is an acrylic thermal conductive interface filling gasket. Due to its soft texture and inherent adhesion on the surface, it is suitable for use in the compression process of integrated circuit chips It can reduce load and is a high-performance silicon-free thermal conductive gasket with high thermal conductivity and a soft interface.
2.5W/mk Thermal Pad HRTP-M16-T02550NN Series
HRTP-M16-T02550NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
1.5W/mk Thermal Pad HRTP-M16-T01550NN Series
HRTP-M16-T01550NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
1.2W/mk Thermal Pad HRTP-M16-T01250NN Series
HRTP-M16-T01250NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
3W/mk Low Volatile Thermal Pad HRTP-M16-T03060NV Series
HRTP-M16-T03060NV Series is an ultra-low volatility thermal conductive silicone pad, which is made of silicone as the matrix and filled with various high-performance ceramic powders. It has low thermal resistance, good electrical insulation, good heat dissipation performance, and ultra-low volatility.
12W/mk Low Volatile Thermal Pad HRTP-M16-T12065NV Series
HRTP-M16-T12065NV Series is an ultra-low volatility thermal conductive silicone pad, which is made of silicone as the matrix and filled with various high-performance ceramic powders. It has low thermal resistance, good electrical insulation, good heat dissipation performance, and ultra-low volatility.
15W/mk Thermal Pad HRTP-M16-T15050NN Series
HRTP-M16-T15050NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
1.5W/mk Thermal Pad HRTP-M16-T01550NN Series
HRTP-M16-T01550NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
6W/mk Thermal Pad with PI Film HRTP-M16-T06065PN Series
HRTP-M16-T06065PN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
3W/mk Thermal Pad with PI Film HRTP-M16-T03060PN Series
HRTP-M16-T03060PN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
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