3W/mk Fiberglass Thermal Pad HRTP-M16-T030FN Series

HRTP-M16-T03060FN Series thermal conductivity interface material is used to fill the air gap between the heating device and the heat sink or metal base. Its flexible and elastic characteristics enable it to cover very uneven surfaces. Heat is transferred from the separating device or the entire PCB to the metal shell or diffusion plate, thereby improving the efficiency and service life of the heating electronic components. The addition of fiberglass is to increase product strength.

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