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  • 2.5W/mk Thermal Pad HRTP-M16-T02550NN Series

2.5W/mk Thermal Pad HRTP-M16-T02550NN Series

HRTP-M16-T02550NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

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Product Features


Good thermal conductive: 2.5W/mk
Naturally tacky no need further adhesive for the surface
High condensability ,soft and flexibility fit for lower stress applications
Available several thickness choice


Product Specifications


Customizable 【 e.g. length x width x thickness (10x5x0.3mmT) 】

Applications


LED Lighting Communication hardware Radiator bottom or frame
Semiconductor automated test equipment High-speed hard disk drive Automotive engine control set

Product Parameters


Property Value Unit Test Method
Thermal Conductivity 2.5  W/mk ASTM D5470
Color Gray / Visual
Hardness

50±5

Shore  00° ASTM D2240
Thickness 0.3-10.0 mm ASTM D374
Thickness Tolerance ±10% mm NA
Density 2.8±0.2 g/cm³  ASTM D792
Tensile Strength

≥0.3

MPa ASTM D412
Operating Temperature -40~180 NA
Flame Rating V-0 / UL94
Dielectric Breakdown Voltage Less than 1mmT>1500
More than 1mmT>5000
Volts AC ASTM D149
Volume Impedance ≥10^13   Ω2.cm ASTM D257
Dielectric Constant 5.5-6.5 @1MHz ASTM D150
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Zhengji New Materials Industrial Park, No. 6 Xufeng Road,
Zhengji Town,Tongshan District, Xuzhou City, Jiangsu Province

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