High-Conductivity Thermal Pads for Electronics Cooling

Suzhou Springgrass is a premier manufacturer of high-performance thermal pads, designed to bridge heat sources and sinks for optimal electronic thermal management.

Versatile Solutions: Offering ultra-thin pads for compact designs and soft silicone sheets for uneven surfaces.
Reliable Heat Dissipation: Engineered to ensure the longevity and peak performance of CPUs and power components.
Custom Die-Cut & OEM (MOQ: 10K pcs): Choose from our standard thermal gap pad sheets or request precision custom die-cut services tailored to your mass production needs.

4W/mk Thermal Pad HRTP-M16-T040 Series

HRTP-M16-T040xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

3W/mk Thermal Pad HRTP-M16-T030 Series

HRTP-M16-T030xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

2W/mk Thermal Pad HRTP-M16-T020 Series

HRTP-M16-T020xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

1W/mk Thermal Pad HRTP-M16-T010 Series

HRTP-M16-T010xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

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The Frequent FAQs of TIM-Thermal Pad

Can you support custom shapes, sizes, thicknesses, and cutouts based on our drawings or CAD files▾

SpringGrass supports full customization: shapes per CAD/DWG/DXF; sizes up to 3000×1500 mm; thickness 0.5–50 mm; cutouts/slots ±0.2 mm tolerance based on your drawings.

What is the typical thermal resistance and thermal conductivity range of your high performance TIM solutions▾

SpringGrass high‑performance TIMs: thermal conductivity 3–12 W/m·K; thermal resistance typically 0.05–0.25 °C·in²/W (≈0.3–1.6 °C·cm²/W) depending on thickness and compression.

What materials and thermal conductivities can you offer for custom thermal pads for different applications▾

SpringGrass offers silicone-based pads 0.8–12 W/m·K, graphite 150–400 W/m·K in-plane, ceramic-filled 3–15 W/m·K, phase-change 2–5 W/m·K; thickness 0.25–5 mm, hardness 20–70 Shore 00.