1W/mk Thermal Silicone Tape HRTP-M16-T010CN Series

HRTP-M16-T01065CN Series thermal conductivity interface material is used to fill the air gap between the heating device and the heat sink or metal base. Its flexibility, elasticity, and toughness characteristics enable it to be used to cover very uneven surfaces. Heat is transferred from the separating device or the entire PCB to the metal shell or diffusion plate, thereby improving the efficiency and service life of heating electronic

components.

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Product Features

■ Good thermal conductive: 1.0W/mK
■ Non-stickiness of product surface
■ High condensability,soft and flexibility fit for lower stress applications
■ Available several thickness choice

Product Specifications

Customizable 【 e.g. length x width (10x5) 】

Applications

■ LED lighting	■ Communication hardware	■ Radiator bottom or frame
■ Semiconductor automatic testing equipment	■ High speed hard drive	■ Automotive engine control device

Product Parameters

Property	Value	Unit	Test Method
Thermal Conductivity	1.0	W/mk	ASTM D5470
Color	Gray/Pink/Blue	/	Visual
Hardness	65±5	Shore 00	ASTM D2240
Thickness	0.23/0.3	mm	ASTM D374
Thickness Tolerance	±0.03	mm	NA
Density	1.6	g/cm³	ASTM D792
Tensile Strength	180	MPa	ASTM D412
Operating Temperature	-40~260	℃	NA
Flame Rating	94-V1	/	UL94
Voltage withstand value	≥2500	Volts AC	ASTM D149