HRTP-M16-T05060NH Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
■ Good thermal conductive: 10.0W/mK
■ Naturally tacky no need further adhesive for the surface
■ High condensability ,soft and flexibility fit for lower stress applications
■ Available several thickness choice
Customizable 【 e.g. length x width x thickness (10x5x0.3mmT) 】
| ■ LED lighting | ■ Communication hardware | ■ Radiator bottom or frame |
| ■ Semiconductor automatic testing equipment | ■ High speed hard drive | ■ Automotive engine control device |
| Property | Value | Unit | Test Method |
| Thermal Conductivity | 5.0 | W/mk | ASTM D5470 |
| Color | Gray | I | Visual |
| Hardness | 60±5 | Shore 00 | ASTM D2240 |
| Thickness | 0.50-10 | mm | ASTM D374 |
| Thickness Tolerance | ±10% | mm | NA |
| Density | 3.27 | g/cm³ | ASTM D792 |
| Tensile Strength | 0.16 | MPa | ASTM D412 |
| Operating Temperature | -40~200 | ℃ | NA |
| Flame Rating | V-0 | / | UL94 |
| Voltage withstand value | Less than 0.5mmT>2500 More than 0.5mmT>5000 |
Volts AC | ASTM D149 |
| Dielectric Breakdown Voltage | ≥1012 | Ω2.cm | ASTM D257 |
| Volume Impedance | 7.89 | @1MHz | ASTM D150 |