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High-Performance Thermal Silicone Pads & Conductive Sheets
Optimize your device's thermal management with our premium thermal silicone pad series. Designed as a flexible thermally conductive silicone sheet, these materials provide excellent interface contact, available in various thicknesses including the standard 1 mm thermal pad. Whether you need a silicone cpu pad for computing hardware or silicone thermal heatsink insulator pads for power electronics, our products deliver reliable performance.
As a versatile conductive silicone pad, it serves as an efficient cooling pad for electronic assemblies and a robust heat conductive pad for sublimation applications. Engineered for optimal silicone pad thermal conductivity, our solutions function effectively as a silicone heat transfer pad, ensuring heat is transferred away from critical components. We also offer specialized grades that act as a heat insulation silicone pad where electrical isolation is required alongside thermal transfer.
2.5W/mk Thermal Pad HRTP-M16-T02550NN Series
HRTP-M16-T02550NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
1.5W/mk Thermal Pad HRTP-M16-T01550NN Series
HRTP-M16-T01550NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
1.2W/mk Thermal Pad HRTP-M16-T01250NN Series
HRTP-M16-T01250NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
15W/mk Thermal Pad HRTP-M16-T15050NN Series
HRTP-M16-T15050NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
1.5W/mk Thermal Pad HRTP-M16-T01550NN Series
HRTP-M16-T01550NN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
6W/mk Thermal Pad with PI Film HRTP-M16-T06065PN Series
HRTP-M16-T06065PN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
3W/mk Thermal Pad with PI Film HRTP-M16-T03060PN Series
HRTP-M16-T03060PN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
12W/mk Thermal Pad HRTP-M16-T120 Series
HRTP-M16-T120xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
10W/mk Thermal Pad HRTP-M16-T100 Series
HRTP-M16-T100xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
8W/mk Thermal Pad HRTP-M16-T080 Series
HRTP-M16-T080xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
6W/mk Thermal Pad HRTP-M16-T060 Series
HRTP-M16-T060xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
5W/mk Thermal Pad HRTP-M16-T050 Series
HRTP-M16-T050xxNN Series thermally conductive interface material sare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
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