HRTP-M16-MSA006VSW350 electronic component sealant can be used at room temperature It reacts with moisture in the air to solidify. Used for various heat dissipation devices splice.
■ Good Thermal Conductive: 0.6W/(m.K)
■ The Surface Dries Quickly
■ Neutral Curing System
■ Excellent High Temperature Electrical Insulation and Stability
■ It has Good Bonding Properties for A Variety of Materials
Customizable 【 e.g. Weight (310cc/2600cc) can 】
■ Bonding of PCB Board and Heat Dissipation Components
■ The Bonding of LED Heat Dissipation Board
| Material properties before curing (25±2℃,55±5%RH) |
Property | Value | Unit | Test Method |
| Color | White | / | Visual | |
| Tack free time | 5-30 | min | GB/T13477.5-2002 | |
| Viscosity | 35±5 | Pa.s | ASTM D2196 | |
| Density | 1.75±0.2 | g/cm³ | ASTM D792 | |
| Material properties after curing (25±2℃,55±5%RH,7d) |
Thermal Conductivity | 0.6±0.1 | W/mk | ASTM D5470 |
| Hardness | 50±5 | Shore A ° | ASTM D2240 | |
| Operating Temperature | -40-180 | ℃ | NA | |
| Tensile strength | 1.0 | MPa | GB/T 528-2009 | |
| Elongation at Break | 90 | % | GB/T 528-2009 | |
| Shear Strength | 1.0 | MPa | GB/T 7124 | |
| Dielectric Strength | ≥14 | kV/mm | ASTM D149-20 | |
| Flame Rating | V-0 | / | UL94 | |
| Durability Period | 6 | Months | NA | |
| Volume Impedance | >1014 | Ω.cm | Visual |
Zhengji New Materials Industrial Park, No. 6 Xufeng Road,
Zhengji Town,Tongshan District, Xuzhou City, Jiangsu Province
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