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  • 2.0W/mk Two-Component Thermal Gel HRTP-M16-GSR020WBW300 Series

2.0W/mk Two-Component Thermal Gel HRTP-M16-GSR020WBW300 Series

HRTP-M16-GSR020WBW300 Series gel is a paste-like gap-filled two-component thermoconductive gel. Can be solidified at room temperature or high temperature conditions, curing product is a soft and excellent thermal conductivity elastomer, formed with the structural shape, for uneven ceramic, radiator surface or irregular circuit board, it has excellent structural adaptability and structural parts surface adhesion characteristics, gap gap filling is full.

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Product Features


Two-Part rapid fixation
After solidification, it has excellent thermal conductivity and elasticity
Forming according to the shape of the structure
Excellent structural adaptability and sufficient filling of gaps and gaps


Product Specifications


Customizable 【 e.g. Weight (30cc/50cc/300cc/1kg/) can 】

Applications


Circuit board Communication hardware  Memory Module
Integrated circuits, CPUs, memory modules Portable electronic devices Universal for thermal conductivity of electronic and electrical components

Product Parameters


Material Properties Before Curing Property Value Unit Test Method
Thermal Conductivity 2.0 W/mk ASTM D5470
Color Blue/White / Visual
Gel A Viscosity

300000±50000

CPS ASTM D2196
Gel B Viscosity

300000±50000

CPS ASTM D2196
Density

2.0±0.2

  g/cm³ ASTM D792
Material Properties After Curing AB Mixing Ratio 1:1 / /
Hardness

60±10

Shore 00 ASTM D2240
Operating Temperature -40~180 NA
Dielectric Breakdown Voltage 1X10^12 Ω2.cm ASTM D257
Breakdown Potential ≥5 KV ASTM D149
Durability Period 6Months / /
Color Blue / Visual
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Zhengji New Materials Industrial Park, No. 6 Xufeng Road,
Zhengji Town,Tongshan District, Xuzhou City, Jiangsu Province

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